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January 2000

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Subject:
Re: wire bonding standards
From:
Rusty Boyd <[log in to unmask]>
Reply To:
Rusty Boyd <[log in to unmask]>
Date:
Thu, 13 Jan 2000 11:24:57 CST
Content-Type:
text/plain
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text/plain (34 lines) 
Thanks for the info so far. I also need MilSpec's regarding the Au bond
pad plating thickness for ultrasonic Al wire bonding in the Au on Ni on
Cu system.
Thanks again,
Rusty


Rusty Boyd
OUHEP - http://oua4.nhn.ou.edu/
[log in to unmask]
24/7 phone number: (405)408-0180
fax: (405)325-7557
University of Oklahoma
Dept. of Physics and Astronomy
440 W. Brooks
Norman, OK 73019
CERN office:
40-3-C11
ph. 767-1170

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