O.K. try this.  Mil-M-38510J, para. 3.5.5.1states "Metallization thickness.
For class S microcircuits, the minimum metallization thickness shall be 8,000
A (800 nm) for single level metal and for the top level of multi-level metal,
and 5,000 A (500 nm) for the lower level(s) of multi-level metal.  In all
cases, the current density requirements of 3.5.5 shall also be satisfied.

Note on this military standard.  Notice 1 issued 27 Aug 1993 turned it
inactive for new designs.  There might be a better standard out there that I'm
not aware of.

Glenn

Rusty Boyd <[log in to unmask]> Wrote:
|
| Thanks for the info so far. I also need MilSpec's regarding the Au bond
| pad plating thickness for ultrasonic Al wire bonding in the Au on Ni on
| Cu system.
| Thanks again,
| Rusty
|
|
| Rusty Boyd
| OUHEP - http://oua4.nhn.ou.edu/
| [log in to unmask]
| 24/7 phone number: (405)408-0180
| fax: (405)325-7557
| University of Oklahoma
| Dept. of Physics and Astronomy
| 440 W. Brooks
| Norman, OK 73019
| CERN office:
| 40-3-C11
| ph. 767-1170

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