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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 19 Jan 2000 15:40:06 EST |
Content-Type: | text/plain |
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Hi-dee ho ya'll!
Gotta question, I gotta a lil' board here (.68" X 4.18") that is double-sided
(all SMT no through-hole) and has a 256-ball µBGA on one side. It's a
prototype right now (we're only building 5 or 10 assemblies).
In my panelization recommendations I was thinking of having the panel made
with the boards alternating top/bottom/top/bottom etc., that way I would only
need one stencil, and we would only have to do one machine set-up when
building the panels, because we would be building both the top and bottom at
the same time. Once one side of the panel is built, you just take it from the
reflow oven and put it back into the printer to do the second side of the
panel, but you wouldn't have to change a thing on the printer or pick and
place machines because the bottom of the panel is an exact mirror of the
top...follow me?
Anyways, my real question is about double-sided reflow of the µBGA, I know
the surface tension will be there to hold the part, but I've never done it
before and don't know for sure if there will be any problems...I wouldn't
think so, but I though I'd ask ya'll to see if any of you have ever done it,
and if there were any problems.
Thanks ya'll!
-Steve Gregory-
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