Hi-dee ho ya'll! Gotta question, I gotta a lil' board here (.68" X 4.18") that is double-sided (all SMT no through-hole) and has a 256-ball µBGA on one side. It's a prototype right now (we're only building 5 or 10 assemblies). In my panelization recommendations I was thinking of having the panel made with the boards alternating top/bottom/top/bottom etc., that way I would only need one stencil, and we would only have to do one machine set-up when building the panels, because we would be building both the top and bottom at the same time. Once one side of the panel is built, you just take it from the reflow oven and put it back into the printer to do the second side of the panel, but you wouldn't have to change a thing on the printer or pick and place machines because the bottom of the panel is an exact mirror of the top...follow me? Anyways, my real question is about double-sided reflow of the µBGA, I know the surface tension will be there to hold the part, but I've never done it before and don't know for sure if there will be any problems...I wouldn't think so, but I though I'd ask ya'll to see if any of you have ever done it, and if there were any problems. Thanks ya'll! -Steve Gregory- ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################