Hello,
I'd like to participate. Thank you very much!!
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
Benjamin Chen (Mobile: +886-987-587-021)
Technical Coordinator, Asia-Pacific, Consulting
Underwriters Laboratories Taiwan Co., Ltd.
Tel: 886-2-2896-7790 ext. 62267.
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- Know by test, and state the facts. -
Web site: http://www.UL.com.tw
"Charlotte \"Yu\" Hao" <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]>
11/06/2008 12:06 PM
Please respond to
Asia Committe Task Group Forum <[log in to unmask]>; Please respond to
"Charlotte \"Yu\" Hao" <[log in to unmask]>
To
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cc
Subject
[TGAsia] Sincerely invite you to join B-10aCN
邀请函
----B-10aCN 技术组招募成员
B-10aCN技术组即将问鼎IPCTGAsia。它将主要开发被业界广泛采用的三项有关湿敏元
器件的标准。
● 《J-STD-020 非密封固态表面贴装器件湿度/再流焊敏感度分类》
● 《J-STD-033 湿度/再流焊敏感表面贴装器件的处置、包装、运输及使用》
● 《J-STD-075 组装工艺中非IC电子元器件的分类》
其中J-STD-020提供了对湿敏元器件的测试方法及分类标准；J-STD-033提供了湿敏元
器件的处置、包装、运输及使用方法；而J-STD-075则给出了在锡铅及无铅工艺的最
坏条件下非半导体电子元器件的组装工艺限值。
该技术组将首先翻译、审核、出版这三项标准的中文版，并与美国的技术组共同审核
、更新这些标准。
来自深圳易瑞来科技开发有限公司的吴波将担任B-10aCN的主席。
诚邀更多的技术人员及专家积极加入B-10aCN！
联系人：郝宇： [log in to unmask]<mailto:[log in to unmask]>；电话：13823187909
吴波： [log in to unmask]<mailto:[log in to unmask]>
Invitation
B-10aCN is recruiting members
B-10aCN will be coming soon, which will focus on three IPC standards about
nonhermetic solid state surface mount devices (SMDs).
● 《J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices》
● 《J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices》
● 《J-STD-075 Classification of Non-IC Electronic Components for Assembly
Processes》
J-STD-020 identifies the classification level of nonhermetic solid state
surface mount devices (SMDs).
J-STD-033 provides SMD manufacturers and users with standardized methods
for handling, packing, shipping, and use of moisture/reflow sensitive SMD
packages that have been classified to the levels defined in J-STD-020.
J-STD-075 outlines worst case industry solder (SnPb and Pb-free) assembly
process limits for non-semiconductor electronic components (hereafter
referred to as ‘‘components’’) along with commodity specific
exceptions to the worst case solder assembly process limits.
At first, the group will translate and review the three documents into
Chinese, at the same time, it will develop and update their new versions
together with B -10a in USA.
Wu Bo undertakes the Chairman of B-10aCN, who is from Shenzhen Erelia
Technologies Co., Ltd..
More technicians and experts are sincerely welcome to join B-10aCN!
Please contact with Hao Yu: [log in to unmask]<mailto:[log in to unmask]>, Mobil:
13823187909
Wu Bo: [log in to unmask]<
mailto:[log in to unmask]>
Hao Yu 郝宇
Technical Resource Coordinator
IPC China
深圳市南山区高新科技园南区科技南十二路方大大厦1807室
Rm 1807, Fangda Bldg, 12th South Keji Road
Hi-Tech Park, Nanshan District, Shenzhen
Tel：+86 755 86141218/86141219
MP：+86 138 2318 7909
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