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Date: | Thu, 10 Jan 2008 16:10:19 +0800 |
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Dennis,
I think you are referring to MIL -STD -202,G, method 208G - solderability.
Right ? Based on this standard, section2.0, it cites that the
solderability test for the components should be done according to
J-STD-002. This method 208G directly make reference to J-STD-002. Thus,
there is no difference in the procedure for carrying the solderability test
of component 's termination. However, you have to check the updated ver.
of J-STD-002 from IPC website
Regards,
Jackson Chan
Technical Services Manager
Cookson Electronics - Alpha Metals
Dennis Cheung
<dennis.cheung@SA
MTEC.COM> To
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Subject
2008/01/10 ¤W¤È [TGA] MIL STD 202 vs J-STD-002
10:15
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Please respond to
Dennis Cheung
<dennis.cheung@SA
MTEC.COM>
Dear all,
Would you like to advise the different between MIL standard and J standard
that caption above? Up to my understanding, MIL STD 202 cover different
test standard for electronics components, where J-STD 002 specify on the
solderability. If it is true, any different between the solderability test
method and requirement that stated in MIL and J-STD?
Regards,
Dennis
Dennis CHEUNG - Regional Field Application Engineer
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