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January 2008

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Subject:
From:
Jackson Chan <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Jackson Chan <[log in to unmask]>
Date:
Thu, 10 Jan 2008 16:10:19 +0800
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Dennis,



I think you are referring to MIL -STD -202,G,  method 208G - solderability.

Right ?  Based on this standard,  section2.0,  it cites that the

solderability test for the components should be done according to

J-STD-002.  This method 208G directly make reference to J-STD-002.  Thus,

there is no difference in the procedure for carrying the solderability test

of component 's termination.  However, you have to check the updated ver.

of J-STD-002  from IPC website



Regards,



Jackson Chan



Technical Services Manager

Cookson Electronics - Alpha Metals







                                                                           

             Dennis Cheung                                                 

             <dennis.cheung@SA                                             

             MTEC.COM>                                                  To 

             Sent by: TGAsia           [log in to unmask]                      

             <[log in to unmask]>                                           cc 

                                                                           

                                                                   Subject 

             2008/01/10 ¤W¤È           [TGA] MIL STD 202 vs J-STD-002      

             10:15                                                         

                                                                           

                                                                           

             Please respond to                                             

               Asia Committe                                               

             Task Group Forum                                              

             <[log in to unmask]>;                                             

             Please respond to                                             

               Dennis Cheung                                               

             <dennis.cheung@SA                                             

                 MTEC.COM>                                                 

                                                                           

                                                                           









Dear all,



Would you like to advise the different between MIL standard and J standard

that caption above? Up to my understanding, MIL STD 202 cover different

test standard for electronics components, where J-STD 002 specify on the

solderability. If it is true, any different between the solderability test

method and requirement that stated in MIL and J-STD?



Regards,

Dennis



Dennis CHEUNG - Regional Field Application Engineer

SAMTEC HONG KONG LIMITED

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