TGASIA Archives

December 2012

TGAsia@IPC.ORG
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Sender:
TGAsia <[log in to unmask]>
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Date:
Wed, 19 Dec 2012 11:05:47 +0800
Reply-To:
Justin Wu <[log in to unmask]>
Subject:
Re: PCB with carbon pad blister after reflow
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1.0
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<000f01cddd95$beffc070$3cff4150$@[log in to unmask]>
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multipart/related; boundary="----=_NextPart_000_0010_01CDDDD8.CD230070"
From:
Justin Wu <[log in to unmask]>
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text/plain (14 kB) , text/html (10 kB) , image001.jpg (14 kB) , image002.jpg (14 kB)

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