LISTSERV - TGASIA Archives - LISTSERV.IPC.ORG

TGASIA Archives

April 2009

TGAsia@IPC.ORG

	LISTSERV Archives
	TGASIA Home
	TGASIA April 2009

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	請教PCB相關問題
From:	Mac Chang (張飛勝) <[log in to unmask]>
Reply To:	Asia Committe Task Group Forum <[log in to unmask]>, Mac Chang (張飛勝) <[log in to unmask]>
Date:	Wed, 22 Apr 2009 16:02:20 +0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (12 lines)

 
各位先進 請不吝告知以下幾個問題

1.無鉛PCB可承受最高溫度?
2.造成PAD脫落的原因為何?
3.造成PCB起泡的原因是?
4.PAD 會類解(使用烙鐵溫度300度)的原因是?
5.BGA CHIP REWORK在同一個點位上一直無法連接成功,PCB PAD吃錫OK,BGA SOLDER BALL OK,是什麼原因造成這種現象?我實在百思不解.


Confidentiality Notice: The information contained in this e-mail and any attachment may be legally privileged and confidential. If you are not an intended recipient, you are hereby notified that any dissemination, distribution, or copying of this e-mail is strictly prohibited. You should not retain, copy or use this e-mail or any attachment for any purpose, nor disclose all or any part of the content to any other person. If you receive this e-mail in error, please notify the sender and permanently delete this e-mail and any attachments immediately.

ATOM RSS1 RSS2

LISTSERV.IPC.ORG