各位先進 請不吝告知以下幾個問題

1.無鉛PCB可承受最高溫度?
2.造成PAD脫落的原因為何?
3.造成PCB起泡的原因是?
4.PAD 會類解(使用烙鐵溫度300度)的原因是?
5.BGA CHIP REWORK在同一個點位上一直無法連接成功,PCB PAD吃錫OK,BGA SOLDER BALL OK,是什麼原因造成這種現象?我實在百思不解.


Confidentiality Notice: The information contained in this e-mail and any attachment may be legally privileged and confidential. If you are not an intended recipient, you are hereby notified that any dissemination, distribution, or copying of this e-mail is strictly prohibited. You should not retain, copy or use this e-mail or any attachment for any purpose, nor disclose all or any part of the content to any other person. If you receive this e-mail in error, please notify the sender and permanently delete this e-mail and any attachments immediately.