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September 2007

TGAsia@IPC.ORG

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Subject:
From:
"George Liu (DMN)" <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, George Liu (DMN)
Date:
Mon, 10 Sep 2007 23:26:16 +0800
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Hi Peter,





 





Totally agree with you. The attached is the comments from Peter Deng of


SGS, FYI.





Best Regards, 





George Liu 


Mobile: +86 139 2337 0460 - NEW! 


e-mail: [log in to unmask] 


"Creating Value that Increases Customer Competitiveness" 





________________________________





From: TGAsia [mailto:[log in to unmask]] On Behalf Of Peter Zhou


Sent: Monday, September 10, 2007 5:28 PM


To: [log in to unmask]


Subject: [TGA] QFN solder joint standard





 








Hi, all: 





I'd like to think it is a good topic for us. Do you have any good idea


for it? 





Best Regards 





Peter Zhou


Assistant Engineering Manager


Simclar Electronics (SuZhou) Co,. Ltd.


Block C#02-01/08, No.5 XingHan Street


SuZhou Industrial Park, 215021, SuZhou, P.R.China


Tel: +86 512 62521808 (Ext. 607)


Fax: +86 512 67618925


MP: 13913124061


E-mail: [log in to unmask]








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