TGASIA Archives

September 2007

TGAsia@IPC.ORG
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Sender:
TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 10 Sep 2007 23:26:16 +0800
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, "George Liu (DMN)" <[log in to unmask]>
Subject:
Re: QFN solder joint standard
From:
"George Liu (DMN)" <[log in to unmask]>
In-Reply-To:
A<[log in to unmask]>
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