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November 2010

TGAsia@IPC.ORG

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Subject:
From:
sungaixian_007 <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, sungaixian_007 <[log in to unmask]>
Date:
Wed, 10 Nov 2010 13:16:25 +0800
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各位:

对于高厚径比软硬结合线路板的钻孔孔内毛刺如何能够去掉?

在钻孔暂时不能改善的前提下,有没有什么好的办法能够去掉孔内的毛刺?

板厚孔径比为9:1 ,钻孔孔径约0.25MM.

请各位赐教.

 

sunny

 

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