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发件人: TGAsia [mailto:[log in to unmask]] 代表 Sky Xu
发送时间: 2014年3月17日 12:12
收件人: [log in to unmask]
主题: [TGAsia] 问题请教---无铅HASL制程中的露铜不良

各位专家好
[cid:[log in to unmask]][cid:[log in to unmask]]
我们是SMT PCBA加工厂，有一个PCBA，出到客户端，经过客户的手焊，外壳组装及灌封胶，成为一个带着焊接引脚的传感器
这个传感器在终端客户处用波峰焊工艺焊接在电路板上。

现在有终端产品失效，分析跟传感器有关，经过对传感器破坏到PCBA层面的分析，好像是PCB表面浸润不良
上图对比照片左侧是良品，右侧是不良品，不良品出现喷锡焊盘上露铜的现象

需要澄清的是，图片上上侧的焊点是我们直接客户的手焊焊点，下侧的焊点是PCB板厂原材的喷锡表面处理，
这样的露铜现象在我们厂内的SMT焊点上只有一个焊盘出现不良（第三图）

请问这样的制程中的露铜浸润不良可能是什么原因引起的

谢谢
Sky

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