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November 2011

TGAsia@IPC.ORG
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Subject:
请教-手工焊接
From:
Jerry Li <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Jerry Li <[log in to unmask]>
Date:
Mon, 7 Nov 2011 09:42:56 +0800
Content-Type:
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大家好，请教如下：
有个产品用的是Wire bonding焊接工艺，是由专门的设备进行焊接的，但由于目前我们公司没有这种设备，想改用手工软钎焊接，如红框部分（两头是PAD，中间是铝导线），


1.       这种方法是否可行？行业是否有这种先例？

2.       焊接导线是铝导线、PCBA PAD是镀金焊盘，二者是否能实现手工焊接焊接

3.       焊接后的焊点如何检验？

4.       焊接温度，烙铁选择如何建议？

5.       焊料是否有特殊要求？

6.       清洗剂的选择建议？

7.       焊接中其他注意事项？
等待你的回复，谢谢！


[cid:[log in to unmask]]


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