TGASIA Archives

March 2008

TGAsia@IPC.ORG

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Subject:
From:
Timmy Ni <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Timmy Ni <[log in to unmask]>
Date:
Tue, 25 Mar 2008 15:16:51 +0800
Content-Type:
multipart/related
Parts/Attachments:
text/plain (5 kB) , text/html (4 kB) , image001.jpg (5 kB)
 

Dear, all,

 

Do you know if there is a standard to define the thickness of solder paste
according to the component soldering area, the soldering area is 50.7mm x
28mm, iron material base with silver plating.

 

Thanks!

 

Best Regards

Timmy Ni 

 


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