TGASIA Archives

March 2008

TGAsia@IPC.ORG
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Sender:
TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>
Date:
Tue, 25 Mar 2008 15:16:51 +0800
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, Timmy Ni <[log in to unmask]>
Subject:
thickness of solder paste vs compontents soldering area
From:
Timmy Ni <[log in to unmask]>
In-Reply-To:
<[log in to unmask]>
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