TGASIA Archives

June 2012

TGAsia@IPC.ORG

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Subject:
From:
"Yun, Xunisa (�晾桡y IES)" <[log in to unmask]>
Reply To:
"Yun, Xunisa (�晾桡y IES)" <[log in to unmask]>
Date:
Fri, 8 Jun 2012 12:30:22 +0800
Content-Type:
multipart/alternative
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text/plain (1105 bytes) , text/html (8 kB)
铜箔被溶解,需检查WS制程之Dwell  time是否超时,原则上此类板卡不可出货。

 

 

发件人: TGAsia [mailto:[log in to unmask]] 代表 Hsun-Yi Tseng
发送时间: 2012年6月8日 11:18
收件人: [log in to unmask]
主题: [TGAsia] 請問附件3種焊接不良現象的IPC判定標準

 

如題求教,謝謝!!

 


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