TGASIA Archives

October 2014

TGAsia@IPC.ORG

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Subject:
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
Tan Geok Ang <[log in to unmask]>
Date:
Mon, 13 Oct 2014 05:59:46 +0000
Content-Type:
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What type of PCB surface finish are you using?

The soak time seems too short as you can find some many voids in your pictures.

________________________________
From: TGAsia [[log in to unmask]] on behalf of Justin Wu [[log in to unmask]]
Sent: Monday, 13 October, 2014 11:27:53 AM
To: [log in to unmask]
Subject: Re: [TGAsia] Dry joints

Hi All,

We are facing the dry joints after reflow soldering and the defective rate is 5%, could you share with me what reason for caused this case?

Note:

1.      The solder paste, component and PCB are unchanged;

2.      The component and solder pads are free of oxidation/contamination;

3.      The reflow soldering temperature profile as shown below:

[cid:[log in to unmask]]

[cid:[log in to unmask]]

Thanks in advance!

Best regards,

Justin


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