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Date: | Mon, 13 Oct 2014 05:59:46 +0000 |
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What type of PCB surface finish are you using?
The soak time seems too short as you can find some many voids in your pictures.
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From: TGAsia [[log in to unmask]] on behalf of Justin Wu [[log in to unmask]]
Sent: Monday, 13 October, 2014 11:27:53 AM
To: [log in to unmask]
Subject: Re: [TGAsia] Dry joints
Hi All,
We are facing the dry joints after reflow soldering and the defective rate is 5%, could you share with me what reason for caused this case?
Note:
1. The solder paste, component and PCB are unchanged;
2. The component and solder pads are free of oxidation/contamination;
3. The reflow soldering temperature profile as shown below:
[cid:[log in to unmask]]
[cid:[log in to unmask]]
Thanks in advance!
Best regards,
Justin
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