康生，陈生，

对于电子元器件的镀层厚度测量，XRF进行非破坏性量测，Cross Section进行破坏性量测，库伦法适应于较薄、厚度较均匀的镀层厚度量测。下面几个镀层厚度的国标供参考，摘录自《电子产品三防技术手册》，马骖等编著：

GB4956-85 磁性测量法，误差小于10％或1.5um的最大值。
GB4957-85 涡流测量法，误差±10％。
GB11250.2-89 X射线光谱测量法，最大测量厚度15um，等效于ASTM-B568-91。
GB5931-86 β射线反向散射法。
GB8015.2-87 光切显微法。
GB5928-86 溶解法。
GB4955-85 库仑法。
GB5929-86 金相显微法。
GB11378-89 轮廓仪法。
ISO3868-76 干涉显微镜法。
ASTM还有一个关于镀层厚度的测量方法，标号忘记了，呵呵。



Peter Deng
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Reliability Lab
Electrical & Electronics 
Consumer Testing Services 
SGS Shenzhen branch

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-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Jackson Chan
Sent: 2007年7月24日 13:52
To: [log in to unmask]
Subject: Re: [TGA] 请教

Hi LF,

For PCB, I know that different specification is established for different
surface finish

I quote here some related standards

IPC-4552 : ENIG
IPC-4553:  Im Ag
IPC-4554: Im Sn

EDS - XRF (non-destructive method)  is one of method to measure the
thickness.  Certainly, the cross section (see IPC-TM-650 2.1.1) should be
capable , in conjuction with the etching technique if applicable.

Besides, IPC 6010 series specifiesthe plating thickness for different type
of boards.


Regards,

Jackson




                                                                           
             lhkang                                                        
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各位,

      请教一下, 有没有关于电子器件（包括PCB）镀层的测试方面的标准？谢谢！

康来辉(LHKang)

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