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May 2007

TGAsia@IPC.ORG

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Subject:
From:
Xiaoping Chen <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Xiaoping Chen <[log in to unmask]>
Date:
Wed, 16 May 2007 21:36:13 +0800
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Hi Chris,





 





I'm Xiaoping Chen from Flex DG process Engineering, my team focus on


NPI. Many works such as DFM, FMEA need to be prepared and sent to


customer for review. But I always questioned by customer for wave


soldering. Do you know which IPC define PCB hole and component lead


ratio? What's the relationship between lead length and lead pitch of


connector? 





 





Wish I can get your advice.





 





Rgds...Xiaoping





 








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