TGASIA Archives

September 2007

TGAsia@IPC.ORG

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Subject:
From:
"John Ling (Jiazhao Ling)" <[log in to unmask]>
Reply To:
John Ling (Jiazhao Ling)
Date:
Tue, 18 Sep 2007 12:07:41 +0800
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Hello, Haley:

    The bonding wire broken near bonding point. Befroe introducing RoHS, we don't have problemon chip LED reflow. TRhe failed LED can light, when mnual solder it agian. We still have PTH LED with 2% reject rate on wave sodlering which we don't have this problem before. 

    Our supplier have no idea to improve it?

    Thanks!

    John Ling

    Loud China 

   

  ----- Original Message ----- 

  From: Haley Deng 

  To: [log in to unmask] 

  Sent: Tuesday, September 18, 2007 11:29 AM

  Subject: Re: [TGA] Chip LED Reflow condition





  Dear John,



   



  What about failure model, ATE test or crack?



   



  Haley



   





------------------------------------------------------------------------------



  From: John Ling (Jiazhao Ling) [mailto:[log in to unmask]] 

  Sent: Tuesday, September 18, 2007 11:19 AM

  To: Asia Committe Task Group Forum; Haley Deng

  Subject: Chip LED Reflow condition



   



  Hello, Haley:



     Our Chip LED has 10% failure after RoHS reflow. DO you Have any idea to control it?



     



      Thanks!

      John Ling

      Loud China 

     







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