TGASIA Archives

April 2011

TGAsia@IPC.ORG
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Sender:
TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, 朱丽娜 <[log in to unmask]>
Date:
Mon, 25 Apr 2011 20:15:23 +0800
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, wubosz <[log in to unmask]>
Subject:
Re: 关于SMT表贴元器件拆焊后再次使用的稳定性
From:
wubosz <[log in to unmask]>
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