TGASIA Archives

March 2008

TGAsia@IPC.ORG
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Sender:
TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, Cony Su <[log in to unmask]>
Date:
Wed, 26 Mar 2008 13:52:11 +0800
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, Timmy Ni <[log in to unmask]>
Subject:
答复: [TGA] thickness of solder paste vs compontents soldering area
From:
Timmy Ni <[log in to unmask]>
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<[log in to unmask]>
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