TGASIA Archives

September 2010

TGAsia@IPC.ORG
Options: Use Monospaced Font
Show HTML Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: 请教锡点上锡标准。
From:
Frank Xiong <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Frank Xiong <[log in to unmask]>
Date:
Thu, 16 Sep 2010 08:58:29 +0800
Content-Type:
multipart/alternative
Parts/Attachments:
text/plain (895 bytes) , text/html (4 kB) 
各位：
 
请教一个插件电容的上锡标准问题：平贴着PCB的插件电解电容，从锡点面看上锡完好
（100%覆盖），但零件面的上锡状况不能检查到！！X-Ray 检查显示内壁上锡效果不
好，爬升高度不到75%。现请教：
 
1） 对这种零件，我们怎么判定它的上锡状况？ 
2）是否有好的建议可以让内部的上锡达到75%，甚至100%？ （我们已将波峰调到最佳
高度，且电容一定要平贴住板）。
 
谢谢了。
 
Best regards,
Frank Xiong
Trio Engineering Co., Ltd.
Tel.:     (86) 20-8490 2933 Ext.257  
Fax:     (86) 20-8490 2273              
Email:   <mailto:[log in to unmask]> [log in to unmask]
Web :    <http://www.triohk.com.hk/> www.triohk.com.hk

______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2