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Date: | Mon, 13 Oct 2014 14:12:05 +0800 |
Content-Type: | multipart/related |
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The PCB surface finish is ENIG.
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang
Sent: Monday, October 13, 2014 2:00 PM
To: [log in to unmask]
Subject: Re: [TGAsia] Dry joints
What type of PCB surface finish are you using?
The soak time seems too short as you can find some many voids in your
pictures.
_____
From: TGAsia [[log in to unmask]] on behalf of Justin Wu [[log in to unmask]
COM]
Sent: Monday, 13 October, 2014 11:27:53 AM
To: [log in to unmask]
Subject: Re: [TGAsia] Dry joints
Hi All,
We are facing the dry joints after reflow soldering and the defective rate
is 5%, could you share with me what reason for caused this case?
Note:
1. The solder paste, component and PCB are unchanged;
2. The component and solder pads are free of oxidation/contamination;
3. The reflow soldering temperature profile as shown below:
Thanks in advance!
Best regards,
Justin
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__________ Information from ESET Endpoint Antivirus, version of virus
signature database 10550 (20141012) __________
The message was checked by ESET Endpoint Antivirus.
http://www.eset.com
TGAsia是一个为业界同仁提供技术交流的平台。您可以在论坛上提出技术问题,交流行
业经验,寻找供应商等。请勿发送任何招聘,广告信息。(注:对于寻求供应商的邮
件,请勿回复[log in to unmask],请私下和发件人联系)。如您需要退出该邮件论坛,请
直接发送邮件至 [log in to unmask] ,谢谢。
__________ Information from ESET Endpoint Antivirus, version of virus
signature database 10550 (20141012) __________
The message was checked by ESET Endpoint Antivirus.
http://www.eset.com
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
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