Hi Chris
    Thank you for response. The problem is (a) oxidation on Ni/Au contact fingers for connector insertion.
    The plating specification is: 1.27 um Min Gold, Nickel underplate 1.27 um Min.
    Application: For connector used in communication/computer/consumer electrical.
 
    BTW, plating thickness for both Ni and Au are no problem.
 
    If there is no direct standard, is there standard for plating residual or element or plating crystal size to judge if a finish is OK/NG? 
 
    Thank you!
 
 
Abao.Liang  
Tyco Electronics AMP GuangDong Ltd. 
Tel:0757-28387543  
Fax:0757-28381456             
E-mail: [log in to unmask] 

 

  _____  

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Chris Katzko
Sent: Friday, September 14, 2007 9:30 AM
To: [log in to unmask]
Subject: [TGA] 答复: [TGA] Plating reliability



Dear Liang, 

Can you please clarify if the problem is (a) oxidation on Ni/Au contact fingers for connector insertion, or (b) oxidation of ENIG (electroless nickel/immersion gold) for soldering? 

This is importiant since the long-term effect must be considered in case (a). 

You should also measure the Ni and Au thickness, these could be factors in the problem. 

C.B. Katzko, CTO
Meadville Group
e-mail  [log in to unmask]
tel            +86 21 3774 7528
fax           +86 21 3774 7590
mobile   +86 13817362590

+++  Please note new tel & fax numbers.  +++ 



"Liang, Abao" <[log in to unmask]> 
发件人:  TGAsia <[log in to unmask]> 


2007-09-12 17:41 


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[TGA] Plating reliability	

		




Hi All 
    Anydody know what is the reliability test standard for plating finish(Ni/Gold finish)? We encounter plating oxidation issue before, we don't have a standard on how long the plating finish can guarantee. And how to test a finish would have oxidation risk. Thank you! 
  

Abao.Liang  
Tyco Electronics AMP GuangDong Ltd. 
Tel:0757-28387543  
Fax:0757-28381456