TGASIA Archives

August 2007

TGAsia@IPC.ORG

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Subject:
From:
李娅婷 <[log in to unmask]>
Reply To:
李娅婷 <[log in to unmask]>
Date:
Tue, 28 Aug 2007 09:20:47 +0800
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&nbsp;IPC关于设计方面的标准是IPC 2220系列(总设计、硬板、软板设计等),但我没有具体看是否设计您所需要的关于匹配方面的问题。



--------- Original Message --------From: "Asia Committe Task Group Forum" &lt;[log in to unmask]&gt;To: &lt;[log in to unmask]&gt;Subject: [TGA] 请教问题Date: 2007/08/28 05:22各位大侠下午好! 请教一个问题: 与PCB设计有关的PAD大小和间距与零件匹配关系的IPC标准是哪个标准,具体内容是如何规定的 谢谢! Best regardsTom JiangAutoliv (China) Electronics(ACE)Tel: +86-21-67109300 Ext.3155 Fax: +86-21-67106845Email:[log in to unmask] 







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