TGASIA Archives

August 2009

TGAsia@IPC.ORG

Options: Use Monospaced Font
Show HTML Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Brandon Tang <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Brandon Tang <[log in to unmask]>
Date:
Fri, 21 Aug 2009 08:04:02 +0800
Content-Type:
multipart/related
Parts/Attachments:
text/plain (16 kB) , text/html (15 kB) , image001.jpg (23 kB) , image002.jpg (16 kB)
Charles

What flux is used on your PCBA , alcohol-based or water-based ? what’s the solid content of flux?  and is there large pad around PTH connector to absorb heat during wave solder  ?

Brandon



________________________________

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Maker Cheng

Sent: 2009年8月20日 17:58

To: [log in to unmask]

Subject: Re: [TGAsia] Solder Balls



Hi Charles,

Usually, we can’t control the solder appear well during the reflow process or wave solder process. Note: IPC-A-610D has defines the solder ball criteria in Section.5.2.6.1, there are many comment for accept the PCBA with solder ball residue.



Is wash process or not wash process in your factory? Maybe you can clear out the solder ball with brush and wash process.



Maker.

________________________________

From: charles.lee [mailto:[log in to unmask]]

Sent: Thursday, August 20, 2009 10:10 AM

To: Cheng, Maker (程仁明 IES); [log in to unmask]

Subject: RE: [TGAsia] Solder Balls



Dear Maker,



It’s definitey  difficult to remove so many solder balls via ESD brush since they are too small. Another potential problem  is that  the sodler balls will become movable balls to hide into pins of  ICs after brush.



Best regards

Charles Lee



________________________________

From: [log in to unmask] [mailto:[log in to unmask]]

Sent: Thursday, August 20, 2009 9:35 AM

To: [log in to unmask]; [log in to unmask]

Subject: RE: [TGAsia] Solder Balls



Hi Charles,

If you can not prevent the solder ball appear in you process well, you can clear out the solder ball with ESD brush in you touch up station after wave solder process to meet IPC standard.



Maker.

________________________________

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Charles Lee(SVA)

Sent: Wednesday, August 19, 2009 11:03 AM

To: [log in to unmask]

Subject: [TGAsia] Solder Balls



Dear All,



There are a great deal of tiny solder balls appeared in around PTH connector pins after wave soldering (PB Process) , please see the attached pictures.



Here we would like to seek your helps and suggestions on how to solve the solder ball issues, thanks!



Best regards

Charles Lee

[cid:[log in to unmask]][cid:[log in to unmask]]






ATOM RSS1 RSS2