TGASIA Archives

May 2013

TGAsia@IPC.ORG
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Subject:
答复： [TGAsia] Soldering bubble problem root
From:
Chi Yeung Pang <[log in to unmask]>
Reply To:
Chi Yeung Pang <[log in to unmask]>
Date:
Thu, 9 May 2013 13:35:58 +0800
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Hi Jeff,

It may be the PCB problem - void PTH hole. Gas is blowed in the PTH hole when wave soldering.

Best regards,

Pang

>>> Jeff Chen <[log in to unmask]> 2013-5-9 12:19 >>>


Dear All,

One of my customer feedback the bubble problem when soldering. The defective sample is as the following cross section chart.

Would you pls kindly help to analysis the root reason of  this problem?
Usually which situation will cause the soldering bubble problem?

Thanks very much for your time and your effort.

Best regards.
Jeff Chen


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