你好，
请您确认一下该PCB的表面涂覆是什么？
1）如为有铅喷锡或无铅喷锡，则PCB制程带入有一定的可能性，您可以加大IQC的监
控水平，以确认PCB时之状态；
2）如是其他诸如化学沉镍金，OSP，沉银等等，则无所谓带入的可能性，您可能更应
该从SMT着手调查，谢谢！
Any Requests, please feel free to contact me! I'll reply to you a.s.a.p.
At your service and best regards!
如果有任何需求，请您别介意联系我!我将第一时间回复您。谢谢&顺祝祺昌！
Davie TungKueng Yiu / 姚东强
Quality Department Engineer
Tel: (86 755) 89300000 ext. 10113
Fax: (86 755) 86096378
Mobile: (86) 15814058013
E-mail: [log in to unmask]
Http: //www.scc.com.cn
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"Wang Xiaojin (AE/MOE2.3-CN)" <[log in to unmask]>
发件人: TGAsia <[log in to unmask]>
2011-04-15 16:50
请答复 给
Asia Committe Task Group Forum <[log in to unmask]>; 请答复 给
"Wang Xiaojin (AE/MOE2.3-CN)" <[log in to unmask]>
收件人
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主题
Re: [TGAsia] PCB工艺产生白胶不良
Hello ALL:
非常感谢大家的反馈.
1.我们做过EDX分析了,以前也作过类似的红外分析,因为外观看起来象胶状物,所以做
的都是塑料相关的,没有做锡膏什么的.
2.不过值得讲的是这种白色的胶状物很难用手抠下来,使劲抠都抠不掉.假如是FLUX什
么的话可以抠掉的,我也试过把SMT线上的一些接料带了,各种胶带了,料膜了等等塑料
制品过炉,过炉后和图片所示很不一样,而且很容易从PCB板上抠下来.
3.因为我们现在这种不良的PPM大概在80左右,有时全检不一定检查出来.前阵子安排
全检也有发现来料的胶状物的,不过是丝状的白色胶状物.
4.另外,这个东西旁边的元件通通都多锡了,所以我们现在怀疑这个东西印刷的时候就
存在,从而导致钢网和BLOCK之间的空隙增大,导致印刷多锡.
Thanks/Regards
Wang Xiaojin
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Petrel Pang
Sent: Friday, April 15, 2011 4:25 PM
To: [log in to unmask]
Subject: Re: [TGAsia] PCB工艺产生白胶不良
Hi all,
You can do SEM/EDX and FTIR to verify the content of the foreign material,
compare with Bare FPC, solder paste or other suspected source, then to
confirm where is the source of the material.
Thank you with Best Regards!
Petrel Tel: 86-756-5322318
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Joseph Ho
Sent: Friday, April 15, 2011 3:52 PM
To: [log in to unmask]
Subject: Re: [TGAsia] PCB工艺产生白胶不良
Dear all,
It doesn’t look like the blistering from PCB.
In 100% inspection by FQC in all PCB suppliers, those extra materials
should be sorted out easily. So sorting of the bare PCB can give you the
result.
I suspect that it’s flux residue as it can solder on it.
With Best Regards
Joseph Ho
From: TGAsia [mailto:[log in to unmask]] On Behalf Of 黃志宏 經理 Leo
Sent: Friday, April 15, 2011 2:29 PM
To: [log in to unmask]
Subject: Re: [TGAsia] PCB工艺产生白胶不良
Dear Xiaojin
其實要確認是否為PCB的問題是很簡單的.對此料號的光板進行全檢
看一下板面是否有此白膠即可.
由圖片上看來很像是滴下的是否應確認回焊爐和錫膏呢.
BR
Leo
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Wang Xiaojin
(AE/MOE2.3-CN)
Sent: Friday, April 15, 2011 1:11 PM
To: [log in to unmask]
Subject: Re: [TGAsia] PCB工艺产生白胶不良
Hello all:
请教大家,PCB生产工艺中有哪些环节会造成如下图所示的白色胶状物的不良.(我们现
在SMT生产过程中发现很多这种不良,而且有些引起多锡了,所以现在觉得应该是PCB来
料就有的)
谢谢大家!
Best Regards!
Leo Wang (王晓金)
* * * * * * * * * * * * * * * * * * * * * * *
RBAC/MOE2.3-AE
Bosch Automotive Products (Suzhou) Co., Ltd.
No.126,Su Hong Xi Road , Suzhou Industrial Park , China
Tel : +86 (512) 67677281
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