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Subject:	答复: 模块的包装
From:	Wellington Li <[log in to unmask]>
Reply To:	Asia Committe Task Group Forum <[log in to unmask]>, Wellington Li <[log in to unmask]>
Date:	Wed, 9 Nov 2011 15:14:02 +0000
Content-Type:	multipart/related
Parts/Attachments:	text/plain (2362 bytes) , text/html (21 kB) , image001.jpg (21 kB)

Dear  刘
      晚上好！
     这些问题多是基本概念，包括模块的生产流程（从Wafer生长、电镀、切割、bonding、封装等）、MSL测试、包装材料等，
对专业的封装测试厂来讲不是问题。
     既然公司并无模块的封装与测试经验，何不找此类代工厂来加工。
     产品的MSL等级是由设计决定的，测试为验证和优化提供了数据。

Best regards,

Wellington Li   李永江
Assessor
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________________________________
发件人: TGAsia [mailto:[log in to unmask]] 代表 刘兵
发送时间: 2011年11月9日 14:44
收件人: [log in to unmask]
主题: [TGAsia] 模块的包装

大家好!
公司自研了一款模块，准备按贴片化进行包装，请教大家：
1.哪家可以测试这种模块（PCB组件）的潮敏等级？联系了赛宝无法测试。
2.哪里有可耐高温的圈装载带或托盘，以及潮敏感标签、真空包装袋？
3.这种模块的生产流程
       以前没有模块生产经验，还请各位指教。谢谢！

刘 兵
电话/TEL：(086)-591-87863025


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