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September 2010

TGAsia@IPC.ORG
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Subject:
答复: [TGAsia] 热应力次数
From:
TL Zhang <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, [log in to unmask][log in to unmask]]
王萍38_30Sep201011:00:[log in to unmask]
Date:
Mon, 27 Sep 2010 09:31:08 +0800
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标准确实是1次就OK了。
很多PCB厂会做3次是出于对下游组装厂的装配过程来考虑的，一般现在的ＰＣＢＡ多
是经过了两遍Reflow,一遍IR,这样就要受到三次热冲击了,所以PCB厂会先做三次热冲
击大致的模拟一下。




sungaixian_007 <[log in to unmask]> 
发件人:  TGAsia <[log in to unmask]>
2010-09-26 09:38
请答复 给
Asia Committe Task Group Forum <[log in to unmask]>; 请答复 给
sungaixian_007 <[log in to unmask]>


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主题
[TGAsia] 热应力次数






大家好:
请教大家一个问题,在很多的硬板(PCB)厂以及很多的客户对PCB的热应力测试次数是3
次.请问3次的要求是出自哪个IPC标准或者是规范?我查阅了IPC 6012 以及
IPC-TM-650 标准,没有发现规定的次数为3次.按照我的理解应该是1次热应力测试没
有发现有问题可以认为了可接受产品!
请大家不吝赐教!
谢谢
Sunny 


全国最低价，天天在家冲照片，24小时发货上门！ 
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