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| Date: | Thu, 10 Nov 2011 08:27:45 +0800 |
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谢谢 ，李工
是这样我司的模块是在PCB小板上贴器件后（如GPS、Wifi模块类的封装），再按贴片要求进行包装。另据我们了解，在福建地区还没有找到专业的生产此类模块的工厂，如有哪位同仁有这方面的资源还请告之，目前我们也在考虑自己学着来做，还请业界同仁相助。多谢！
刘 兵
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发件人: Wellington Li [mailto:[log in to unmask]]
发送时间: 2011年11月9日 23:14
收件人: Asia Committe Task Group Forum; 刘兵
主题: 答复: 模块的包装
Dear 刘
晚上好！
这些问题多是基本概念，包括模块的生产流程（从Wafer生长、电镀、切割、bonding、封装等）、MSL测试、包装材料等，
对专业的封装测试厂来讲不是问题。
既然公司并无模块的封装与测试经验，何不找此类代工厂来加工。
产品的MSL等级是由设计决定的，测试为验证和优化提供了数据。
Best regards,
Wellington Li 李永江
Assessor
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发件人: TGAsia [mailto:[log in to unmask]] 代表 刘兵
发送时间: 2011年11月9日 14:44
收件人: [log in to unmask]
主题: [TGAsia] 模块的包装
大家好!
公司自研了一款模块，准备按贴片化进行包装，请教大家：
1.哪家可以测试这种模块（PCB组件）的潮敏等级？联系了赛宝无法测试。
2.哪里有可耐高温的圈装载带或托盘，以及潮敏感标签、真空包装袋？
3.这种模块的生产流程
以前没有模块生产经验，还请各位指教。谢谢！
刘 兵
电话/TEL：(086)-591-87863025
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