TGASIA Archives

December 2010

TGAsia@IPC.ORG

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Subject:
From:
OPR/MTD-HM/PPT Wei Jian Kang <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, OPR/MTD-HM/PPT Wei Jian Kang <[log in to unmask]>
Date:
Sat, 4 Dec 2010 08:33:35 +0800
Content-Type:
multipart/related
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text/plain (6 kB) , text/html (12 kB) , image002.gif (6 kB)
Justin Wu:
 
如果你不能在PCB板方面改善的话,你可以尝试将被焊元件脚跟随铜铂方向贴板弯曲(元
件脚在可以弯曲的基础下)后再用0.5mm锡线焊接,可能焊接效果有改善。
 
东莞Defond公司
 
卫建康

________________________________

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Justin Wu
Sent: Friday, December 03, 2010 8:59 PM
To: [log in to unmask]
Subject: Re: [TGAsia] Consultation



Hi All,

 

We found some poor solderability on the PCB due to shifting of solder mask to
cause less area of solder pad to form a good joint. We tried to hand solder
but still no good. So, would you please help advise whether it is can be
repaired? 

 

 

Thanks in advance!

 

Best regards,

Justin Wu

Utilux South China Ltd

Phone: +86-755-2850 7521

Fax:    +86-755-2850 0927

E-mail Address: [log in to unmask] <mailto:[log in to unmask]>




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