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September 2010

TGAsia@IPC.ORG

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Subject:
From:
sungaixian_007 <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, sungaixian_007 <[log in to unmask]>
Date:
Sun, 26 Sep 2010 09:38:40 +0800
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大家好:
请教大家一个问题,在很多的硬板(PCB)厂以及很多的客户对PCB的热应力测试次数是3次.请问3次的要求是出自哪个IPC标准或者是规范?我查阅了IPC 6012 以及IPC-TM-650 标准,没有发现规定的次数为3次.按照我的理解应该是1次热应力测试没有发现有问题可以认为了可接受产品!
请大家不吝赐教!
谢谢
Sunny

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