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November 2011

TGAsia@IPC.ORG

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Subject:
From:
Vince Tian <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Vince Tian <[log in to unmask]>
Date:
Thu, 1 Dec 2011 03:36:23 +0000
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All :

是否有IPC 标准定义 PCB 生产前一定要烤板才能过reflow
No ,I do not think this is mandatory for SMT.

或者 是过期pcb 生产前一定要烤板才能过reflow  ?
Its depends, I do suggest do solderability test more than baking for those expired materials.

如有,能否share 相应的章节。

thanks
TERRY

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