As highlighted by Ping Liu about S/M that has the same element detected,
would this Dewetting be due to S/M residue on the solder pad?
In the PCB process, if there is S/M on pad and they has rework it before
the HSAL, it's possible that the S/M elements can be detected. The S/M
residue can be a cause for Dewetting.
Best Regards,
Joseph Ho
Senior Quality System Manager, QS and LEAN
Multek Display Limited
Tel : (86) 755 2862 0888 Ext.269
Mobile: (86) 138 25275770
Endless innovation creates changes for tomorrow
________________________________
From: Rainbow Zhang
Sent: Tuesday, November 22, 2011 3:48 PM
To: Asia Committe Task Group Forum; Joseph Ho
Subject: RE: [TGAsia] Non-wetting on PTH top surface
Joseph, I am not sure the PCBA has been contaminated during the
cross-section process, but one thing for sure is that we have
cross-section for both NG board and good board under the same condition,
but only detected the Ai and Si on the NG board.
The surface treatment is Immersion Au, the Si and Al can be only
detected on non-wetting hole as below.
Hi Ken Chow,
What evidence we may look into as a measurement in determining of rework
at PCB housing.
Thanks
Rainbow
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Joseph Ho
Sent: Tuesday, November 22, 2011 1:14 PM
To: [log in to unmask]
Subject: Re: [TGAsia] Non-wetting on PTH top surface
Did you place the board in an area for cross-sectioning as the emery
paper used in polishing the cross-section may have the Al and Si. The
solder surface is so soft that the Al and Si particles may have been
embedded on the surface causing such result in EDX.
Best Regards,
Joseph Ho
Senior Quality System Manager, QS and LEAN
Multek Display Limited
Tel : (86) 755 2862 0888 Ext.269
Mobile: (86) 138 25275770
Endless innovation creates changes for tomorrow
________________________________
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Ken Chow
Sent: Tuesday, November 22, 2011 11:30 AM
To: [log in to unmask]
Subject: Re: [TGAsia] Non-wetting on PTH top surface
May be the board has been reworked by powder polishing such as jet
scrubbing or manual sanding (Al2O3 and Si2O4)
Thanks and best regards,
Ken Chow
OEM & Business Development Director,
Enthone, Cookson Electronics
Mobile: +852-9408-4736
________________________________
From: Tan Geok Ang [[log in to unmask]]
Sent: 11/22/2011 10:04 ZE8
To: <[log in to unmask]>
Subject: Re: [TGAsia] Non-wetting on PTH top surface
Did you EDX the different between the non-wetting points vs. solder
joints?
Are you using ImAg PCB surface?
________________________________
From:TGAsia [mailto:[log in to unmask]] On Behalf Of Rainbow Zhang
Sent: Monday, 21 November 2011 10:06 AM
To: [log in to unmask]
Subject: Re: [TGAsia] Non-wetting on PTH top surface
Hi All,
I want to share a case with you all here and collect your comments as I
get a little stuck in determining what is real root of the issue.
Referring to the photo attached the solder pad was not fully covered by
solder after manually solder, not meeting the IPC-610 requirement of at
minimum of 75% solder be covered around the pad. observed under digit
camera there some darkish residue remained on there, and main elements
spot by EDX as illustrated, to what surprise is where did Al and SI come
from since the used solder material do not contain these two elements.
Legal Disclaimer: The information contained in this message may be
privileged and confidential. It is intended to be read only by the
individual or entity to whom it is addressed or by their designee. If
the reader of this message is not the intended recipient, you are on
notice that any distribution of this message, in any form, is strictly
prohibited. If you have received this message in error, please
immediately notify the sender and delete or destroy any copy of this
message
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud
service.
For more information please contact helpdesk at x2960 or
[log in to unmask]
______________________________________________________________________
Legal Disclaimer: The information contained in this message may be
privileged and confidential. It is intended to be read only by the
individual or entity to whom it is addressed or by their designee. If
the reader of this message is not the intended recipient, you are on
notice that any distribution of this message, in any form, is strictly
prohibited. If you have received this message in error, please
immediately notify the sender and delete or destroy any copy of this
message
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud
service.
For more information please contact helpdesk at x2960 or
[log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud
service.
For more information please contact helpdesk at x2960 or
[log in to unmask]
______________________________________________________________________
NOTE: This electronic message (including any attachments) contains
information which may be privileged, confidential , or copyrighted under
applicable law. The information is intended solely for the use of the
individual(s) or entity named above. If you are not the intended
recipient, please be aware that any disclosure, viewing, copying,
alteration, dissemination, distribution of, or use of the contents of
this information in whole or in part is strictly prohibited. If you
received this electronic transmission in error, please notify the sender
immediately by replying to this message and delete the copy you
received.
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud
service.
For more information please contact helpdesk at x2960 or
[log in to unmask]
______________________________________________________________________
Legal Disclaimer: The information contained in this message may be
privileged and confidential. It is intended to be read only by the
individual or entity to whom it is addressed or by their designee. If
the reader of this message is not the intended recipient, you are on
notice that any distribution of this message, in any form, is strictly
prohibited. If you have received this message in error, please
immediately notify the sender and delete or destroy any copy of this
message
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud
service.
For more information please contact helpdesk at x2960 or
[log in to unmask]
______________________________________________________________________
Legal Disclaimer:
The information contained in this message may be privileged and confidential. It is intended to be read only by the individual or entity to whom it is addressed or by their designee. If the reader of this message is not the intended recipient, you are on notice that any distribution of this message, in any form, is strictly prohibited. If you have received this message in error, please immediately notify the sender and delete or destroy any copy of this message
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
