Hi Lewis and Eddie,

The hot air temperature mentioned in 7711/21 is recommended, you may adjust it if necessary. Many conditions affect the temperature, such as PCB thickness, thermal pad effective, multi-layers, component size… You may check out the temperature of component and solder joint and adjust the temperature, and then soldering/rework it as proper. Anyway, as low as well.



B/R

Leo Yang

IPC Training Dept.

Tel: 021-54973435-616

M/P: 013013774245

Fax: 021-54973437

www.ipc.org/www.ipc.org.cn

________________________________

发件人: TGAsia [mailto:[log in to unmask]] 代表 Eddie Yuan

发送时间: 2010年3月2日 14:23

收件人: Listserv TGAsia

主题: Re: [TGAsia] [RMX:##] [TGAsia] measure the hot air temperature method





I think you can use a thomermal couple to verify the actual temperature.



Hot air temp 425 C is too high for the some components repair. You should check whether the component can bear such high temp, or not.





Thanks and best regards

Eddie



Lewis Liu <[log in to unmask]>

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03/02/2010 12:03 PM

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[RMX:##] [TGAsia] measure the hot air temperature method





















Hi,All:

In IPC 7721 and 7711 document just mentioned the hot air temperature  is approximately 425℃ and adjust it if necessary ，but it didn’t define the test method to get the real  temperature.

Do you have the relative solutions?

Thanks,



Lewis Liu (刘定豪）

Engineering Department

Failure Analysis laboratory Supervisor

Tel:+86 -25- 52728710

Cell:+86 -25 -13851527451

Mail:  [log in to unmask]<mailto:[log in to unmask]>

Kimball Electronics (Nanjing) Co.,Ltd





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