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April 2009

TGAsia@IPC.ORG
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Subject:
Re: chip-0603 锡 珠不良
From:
Peter Zhou <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 9 Apr 2009 08:33:21 +0800
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (1159 bytes) , text/html (2548 bytes) , 钢板开孔.JPG (8 kB) 
Dear Toby:



The simplest way is to use N2.



B.R.



Peter Zhou

Engineering Manager

Simclar Electronics (SuZhou) Co,. Ltd.

Block C#02-01/08, No.5 XingHan Street

SuZhou Industrial Park, 215021, SuZhou, P.R.China

Tel: +86 512 62521808 (Ext. 607)

Fax: +86 512 67618925

MP: 13913124061

E-mail: [log in to unmask]









HouToby <[log in to unmask]> 

Sent by: TGAsia <[log in to unmask]>

2009-04-08 21:23

Please respond to

Asia Committe Task Group Forum <[log in to unmask]>; Please respond to

HouToby <[log in to unmask]>





To

[log in to unmask]

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Subject

[TGAsia] chip-0603锡 珠不良













Dear all:

最近遇到了个很棘手的问题,现在公司有一个产品,每次生产,板子上0603chip零件体

侧有锡珠产生,位置很不固定.偶尔这个位置,偶尔另外一个位置,最大的直径有

0.2-0.3mm,最小的只有0.08mm. 现在试过很多解决方案,减少置件压力,调整温度曲线

,缩小钢板开孔面积(现只有84%),板子也烘烤过, 锡膏在其他的产品也使用,但是未发

现.现有的PCB 板是镀金板. 各位还有什么好的解决办法?

 

另外对于锡珠的标准问题,现有的IPC-A-610D 定义不违反最小电气间隙,还是否有其

他的标准,目前我们板子上最小间距零件为0.5mm 

 



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