我的理解是:

         可能部分元器件在貼在PCB PAD上,元器件与PAD間的焊錫厚度!

 

________________________________

From: Rocky Wang [mailto:[log in to unmask]] 
Sent: Wednesday, November 09, 2011 10:58 AM
To: airmy(b 鄧冬強); Asia Committe Task Group Forum
Subject: RE: [TGAsia] 焊锡高度定义

 

Airmy,谢谢.

 

请问大家,下图中的G是如何具体定义的?

 

Best Regards

Rocky

 

From: airmy(b 鄧冬強) [mailto:[log in to unmask]] 
Sent: Wednesday, November 09, 2011 10:44 AM
To: Asia Committe Task Group Forum; Rocky Wang
Subject: RE: [TGAsia] 焊锡高度定义

 

有, 請參閱“IPC –A- 610E”第8節SMT工法部分

 

 

________________________________

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Rocky Wang
Sent: Wednesday, November 09, 2011 10:12 AM
To: [log in to unmask]
Subject: [TGAsia] 焊锡高度定义

 

请教大家:

        通常的SMT流程中,在solder paste printing 之后,都会进行检测锡膏厚度,  并要求控制锡膏的厚度在一定的范围之内.  

在回流之后,是否对焊锡高度也有要求? 如附图. 若是5mil的钢网,回流后焊锡高度(chip 物料), 谢谢!

 

Best Regards

Rocky

 


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________