Hi Charles,
Yes, this problem was always exists in the same location, i.e. the buzzers in connection with solder pads (Note: the buzzers is mounted onto solder pads).
Thanks for your advice. However, maybe we can’t expect what results as the defective rate is 0.5% only.
Thanks and best regards,
Justin
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Charles Lee(DD&TT)
Sent: Monday, October 13, 2014 2:52 PM
To: [log in to unmask]
Subject: Re: [TGAsia] Dry joints
Dear Justin,
Could you please let me know if NG solder joints are concentrated in some fixed places (pads or components)?
You can take some bare PCBs to print solder paste and then go through reflow oven (don’t place any components), to check if there is any de-wetting issue occurred in PCBs? This is to identify the qualify issue is caused by PCB board or NOT first.
Best Regards
Charles Lee
Please consider the environment before printing this E-mail.
发件人: Justin Wu <[log in to unmask]>
答复: Justin Wu <[log in to unmask]>
日期: Monday, October 13, 2014 at 2:12 PM
至: <[log in to unmask]>
主题: Re: [TGAsia] Dry joints
The PCB surface finish is ENIG.
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang
Sent: Monday, October 13, 2014 2:00 PM
To: [log in to unmask]
Subject: Re: [TGAsia] Dry joints
What type of PCB surface finish are you using?
The soak time seems too short as you can find some many voids in your pictures.
_____
From: TGAsia [[log in to unmask]] on behalf of Justin Wu [[log in to unmask]]
Sent: Monday, 13 October, 2014 11:27:53 AM
To: [log in to unmask]
Subject: Re: [TGAsia] Dry joints
Hi All,
We are facing the dry joints after reflow soldering and the defective rate is 5%, could you share with me what reason for caused this case?
Note:
1. The solder paste, component and PCB are unchanged;
2. The component and solder pads are free of oxidation/contamination;
3. The reflow soldering temperature profile as shown below:
Thanks in advance!
Best regards,
Justin
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