TGASIA Archives

May 2013

TGAsia@IPC.ORG

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Subject:
From:
Jeff Chen <[log in to unmask]>
Reply To:
Jeff Chen <[log in to unmask]>
Date:
Thu, 9 May 2013 12:19:49 +0800
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Dear All,

One of my customer feedback the bubble problem when soldering. The defective sample is as the following cross section chart.

Would you pls kindly help to analysis the root reason of  this problem?
Usually which situation will cause the soldering bubble problem?

Thanks very much for your time and your effort.

Best regards.
Jeff Chen


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