TGASIA Archives

April 2011

TGAsia@IPC.ORG

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Subject:
From:
Alvin Ling <[log in to unmask]>
Reply To:
Alvin Ling <[log in to unmask]>
Date:
Wed, 13 Apr 2011 15:45:40 +0800
Content-Type:
multipart/related
Parts/Attachments:
text/plain (6 kB) , text/html (29 kB) , image001.gif (5 kB)
Justin ,

If the materials and dimension are fulfill the requirements how  can you made the judgment are related to the supplier caused the incident of solder ball .It may be related the storage environment ( moisture in the PCB ). 

Alvin
  ----- Original Message ---
  From: Justin Wu 
  To: 'Alvin Ling' ; [log in to unmask] 
  Sent: Wednesday, April 13, 2011 3:39 PM
  Subject: RE: [TGAsia] Solder Ball


  Hi Alvin,

   

  Yes, the PCB layout was designed by our Engineering Team. I would like to know why I can't claim the PCB manufacturer. Any input?

   

   

  Thanks and best regards,

  Justin Wu

  Utilux South China Ltd

  Phone: +86-755-2850 7521

  Fax:    +86-755-2850 0927

  E-mail Address: [log in to unmask]

   


------------------------------------------------------------------------------

  From: TGAsia [mailto:[log in to unmask]] On Behalf Of Alvin Ling
  Sent: Wednesday, April 13, 2011 3:31 PM
  To: [log in to unmask]
  Subject: Re: [TGAsia] Solder Ball

   

  Justin ,

   

  I have the quaestion who design the PCB layout from your engineering team or by PCB supplier . If the design from your team how you can claim the supplier ?

   

  Alvin 

    ----- Original Message ----- 

    From: Justin Wu 

    To: [log in to unmask] 

    Sent: Wednesday, April 13, 2011 3:18 PM

    Subject: Re: [TGAsia] Solder Ball

     

    Thanks Mr. Zhao.

     

    Yes, we have claimed to PCB manufacturer accordingly.

     

     

    Thanks and best regards,

    Justin Wu

    Utilux South China Ltd

    Phone: +86-755-2850 7521

    Fax:    +86-755-2850 0927

    E-mail Address: [log in to unmask]

     


----------------------------------------------------------------------------

    From: TGAsia [mailto:[log in to unmask]] On Behalf Of WM-FQA-Zhao ZiDe
    Sent: Wednesday, April 13, 2011 2:59 PM
    To: [log in to unmask]
    Subject: Re: [TGAsia] Solder Ball

     

    Dear Justin Wu:

    From the photo, we can find the solder ball on topside PTH, due to solder mask in the PTH and caused the hot air chould not through the TH at the HASL process, if void the same question reoccur, the solder mask film need be revised. you can let the PCB manfuacture plant to enlarge the solder mask opening or plug the TH by solder mask.

     

    Many Thanks,
    Best Regards,

     

    Zhao Zi De
    QA Department
    World Mastery Technology Limited

     

    Tel:+86 769 85569149  Ext:862
    Fax:+86 769 85262272
    Email:[log in to unmask]

      ----- Original Message ----- 

      From: Justin Wu 

      To: [log in to unmask] 

      Sent: Wednesday, April 13, 2011 12:08 PM

      Subject: Re: [TGAsia] Solder Ball

       

      Hi All,

       

      We have found some solder balls inside TH on the PCB (See below photo), however there is no exact matching of the defect mentioned in IPC, but according to IPC-A-610 Clause 5.2.7.1, the solder ball is accepted if it is embedded in the solder resist. So, would you please share your experience in such case with me?

       

      Thanks in advance!

       

      Best regards,

      Justin Wu

      Utilux South China Ltd

      Phone: +86-755-2850 7521

      Fax:    +86-755-2850 0927

      E-mail Address: [log in to unmask]

       

       



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