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December 2010

TGAsia@IPC.ORG
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Subject:
芯片焊接
From:
郝兆兵 <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, 郝兆兵 <[log in to unmask]>
Date:
Wed, 29 Dec 2010 12:57:19 +0800
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各位：
   请教 芯片性能文件中的工作温度范围 同 焊接芯片时的温度有无必然联系。
2010-12-29 

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