Interesting picture which creates more questions than give answers and definitely doesn't prove the point, at least to me.
Regards,
Vladimir
Sent from my BlackBerry 10 smartphone on the Rogers network.
Original Message
From: Guy Ramsey
Sent: Wednesday, August 12, 2015 12:26
To: [log in to unmask]
Reply To: [log in to unmask]
Subject: Re: [TN] immersion silver
http://blog.ipc.org/2009/04/20/gold-au-and-silver-ag-embrittlement-of-solder
-joints/
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Tuesday, August 11, 2015 8:02 AM
To: [log in to unmask]
Subject: Re: [TN] immersion silver
Hi Guy,
With all due respect to Warner memory, silver IS NOT like gold and DOES NOT
cause embrittlement.
Therefore, from the reliability point of view it wouldn't matter what
thickness of IAg was on a board, as long as we ONLY talking about the amount
of Ag which would and up in the joints after re-flow.
Regards,
Vladimir
Sent from my BlackBerry 10 smartphone on the Rogers network.
Original Message
From: Guy Ramsey
Sent: Tuesday, August 11, 2015 07:37
To: [log in to unmask]
Reply To: [log in to unmask]
Subject: Re: [TN] immersion silver
If Werner were alive he would be reminding us that silver, like gold, is a
contaminate in tin solder.
Early finishes, prior to 2005 or so, weren't good for multiple reflows. Some
presumed it was too thin.
I believe the problem was the durability of the organic additives that
retard oxidation of the silver.
Not perfect, but it is my preferred surface finish, but not too thick.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Monday, August 10, 2015 3:47 PM
To: [log in to unmask]
Subject: [TN] immersion silver
Hi All,
Why would someone choose thick immersion silver over thin? Are these
different chemistries? Regards Steve Kelly
Phone(O) (416) 750-8433
Phone (C) (416) 577-8433
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