TECHNET Archives

April 2019

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
[log in to unmask]
Date:
Mon, 1 Apr 2019 17:37:47 -0500
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Subject:
Re: Thin Hole Plating
MIME-Version:
1.0
Message-ID:
<[log in to unmask]>
Content-Type:
text/plain; charset="UTF-8"
Content-Transfer-Encoding:
quoted-printable
From:
Jack Olson <[log in to unmask]>
Parts/Attachments:
text/plain (8 lines) 
On Tue, 12 Mar 2019 17:47:32 -0400, Dennis Fritz <[log in to unmask]> wrote:

>Fischer has a range of non-destructive instruments that can measure copper
>plating in vias.  The principle is the use of eddy currents.   See this
>link and then go to a description of the instruments -

Thanks. Our lab now has an eddy current tester!

ATOM RSS1 RSS2