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Thu, 18 Sep 1997 11:18:54 -0500 |
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Address,
Assuming you have three (3) oxides present Cuprous Oxide, Cupric Oxide
and Cuprous Sulfide, how thick is to thick when using the following
fluxes?
1. OA -
2. RMA -
3. No-Clean -
When is it determined that the oxide is so thick that standard dwell
times in process can not remove the oxides regardless?
i.e., If I have a thickness of 96A of Cupric Oxide while using an OA
solderpaste at Conveection Reflow, how much could I expect to be
removed and will all of it be removed?
Has anyone determined the limits or ratios of flux activity to oxide
thicknesses?
Lets also assume that there are no intermettalics effecting the
solderability since no known fluxs can penetrate the IMC.
Thank you.
John Gulley
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