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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 20 Mar 1998 10:19:41 -0500 |
Content-Type: | TEXT/PLAIN |
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RESPONSE TO THE QUESTION:
There are three requirements in the paragraph:
1. As a min., the lead shall be discernible in the completed
solder connection.
The lead needs to be discernible on the etch side (side
opposite the component) for through-hole so that a visual
inspection can determine if the lead is in fact through the PTH
and not cut too short or bent under the component.
2. The lead should not extend more than 1.5 mm (measured
vertically) from the PWB surface
The requirement is that the maximum lead extension beyond
the surface of the board be 1.5 mm or less or approximately 0.060
inch maximum.
3. and the lead must not violate minimum electrical spacing
requirements.
Regardless of the lead length (0 to 0.60 inch), the lead
extension cannot violate minimum electrical spacing requirements
required by the design. For example, if the lead extends only
0.20 inch and it violates the minimum electrical spacing distance
between the lead and, say, another board or part of a chassis
just below the lead, the 0.20 inch lead length will have to be
shorter even though it is well within the 1.5 mm maximum allowed
length.
ORIGINAL QUESTION:
Please answer the following concerns:
J-STD-001B Para 6.5.3 2nd paragraph:
As a min., the lead shall be discernible in the completed solder
connection. The lead should not extend more than 1.5 mm
(measured vertically) from the PWB surface and the lead must not
violate minimum electrical spacing requirements.
The questions is:
Can we have both ways or is there just one way for this process?
Must the leads be discernible or do we have to have the lead
extend throughout the board.
Maryanne Letteri
Quality Specialist
PS. Lee Gilgosch who works with me is a member of IPC.
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