Hi all!

We've been building an assembly here for quite a while, and just recently
experienced quite a bit of failures at ICT with one IC. Out of 50 assemblies,
only 3 passed. The failures on the rest of them have been with one IC at the same
location.

I've x-ray'ed the failed parts and don't seen any broken or missing wire
bonds, so I wanted to take a look at the die area to see if I could spot something
obvious.

-Steve Gregory-


> I have done this a few times with a 1/8" end mill. It is easier to clamp it
> tight if you remove the leads first.
> I'm curious too.
> Charles
>
> -----Original Message-----
> From: Dehoyos, Ramon [mailto:[log in to unmask]]
> Sent: Thursday, July 24, 2003 12:06 PM
> To: [log in to unmask]
> Subject: Re: [TN] Plastic IC Decapsulation...
>
>
>         Steve:
>         Do you want to decapsulate the IC to view  ESD damage with an SEM?
> Or what is the purpose? Just curious. You should be able to pry the top off
> with a sharp thin blade by inserting it in between top and bottom part of
> the casing ( notice a line ) or perhaps saw the top off with a dremel saw .
> The IC itself is in the bottom part of the casing in a recessed area, so no
> damage will occur to it.
>         Regards,
>         Ramon
>
> > -----Original Message-----
> > From: Steve Gregory [SMTP:[log in to unmask]]
> > Sent: Thursday, July 24, 2003 9:57 AM
> > To:   [log in to unmask]
> > Subject:      [TN] Plastic IC Decapsulation...
> >
> > Mornin' All!!
> >
> > Been rather quiet on the list over the past week or so, hadn't it? Either
> > means everybody is on vacation, or everybody is so busy building stuff
> > without problems that they don't have any spare time...like to wish that
> > was the case.
> >
> > Anyway, about Plastic IC Decapsulation, is that something I could do
> > myself? If so, what sort of chemicals would I use? Or is this something
> > better left to be done by the people who do that for a living, like
> > failure analysis labs?
> >
> > Thanks!
> >
> > -Steve Gregory-
>


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