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January 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 14 Jan 2002 06:46:45 -0600
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Peter,

I echo all you say. What do the board shop folks say? Does anyone have any
x-sections showing one or more of these plated "shut" holes?

Also, back up what you said about "divots" in pads plated over. Haven't been
able to ge a flat surface on these things but they work well enough when
used with RF chip device solder termination areas to prevent solder
drain-off. This is a good alternative, to sequential lamination, for those
convinced these vias are necessary in the firt place to ensure required
performance.

Earl

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